Mi Equipment is a Leading Semiconductor Equipment Solutions Provider, offering advanced AI Enabled Die Sorting & Smart Binning, Wafer Reconstruction, Precision Bonding, Laser Bonding, Test Handling, AI Vision Inspection and Smart Factory platforms through our Mi, Ai, Si and Vi series of products serving the Mobility & Wearables, HPC & Memory and Automotive & Renewable Energy Segments.
We have strong global presence with world class R&D centers and manufacturing facilities in Malaysia and China as well Sales & Service networks covering Asia, North & Central America and Europe. We are proud to be part of Mi Technovation Berhad.